High Grinding Efficiency
Silicon-nitride media have a Vickers hardness of 14–18 GPa, versus 10–13 GPa for zirconia. The higher hardness of silicon nitride delivers faster size reduction and higher throughput.
The 24-hour wear rate of silicon-nitride media is only 10ppm—effectively zero.This negligible wear reduces contamination of the product, enabling higher-purity ultra-fine powders and eliminating concerns over impurity pick-up. Consequently,
switching to silicon-nitride media offers an economical route to upgrading high purity, ultra-fine powder production.
Technical Specifications
Physical
Density: 3.25 g/cm3
Vicker's hardness: 15GPa
Corrosion resistance: good
Available size: 0.1 - 30mm (others customizable)
Thermal
Coefficient of linear expansion: 3.4
Specific heat: 800 J·kg-1·K-1
Max. operating temperature: 1050°C
Thermal conductivity: 20 W/(m·K)
Thermal shock resistance: good
Mechanical
Young's modulus: 310GPa
Compressive strength: 3500 MPa
Modulus of rupture: 700 - 800 MPa
Fracture toughness:5 - 7 MPa·√m
Wear Rate Comparison
Average wear as low as 0.01 g·kg-1·h-1
Technical Data Comparison
Superior Performance
Low Friction and Heat Generation
Reduced friction leads to lower energy consumption and less heat generation during grinding, improving efficiency and preventing damage to temperaturesensitive materials.
High Strength and Toughness
This combination ensures resistance to fracture, even under high impact and stress conditions. This is critical for high-speed and high-load grinding operations.
Chemical Inertness
Its resistance to chemical attack ensures minimal contamination, essential for producing high-purity materials in sensitive industries like pharmaceuticals and electronics.
This inertness also allows for use in corrosive environments.
High Thermal Stability
Silicon nitride withstands high temperatures without degradation, making it suitable for high-temperature grinding processes.
This is particularly important in advanced ceramic and metal processing.